March 2018

$2 Million Heterogeneous Assembly Equipment Investment

Two years. Two million dollars. Check out what we’ve added at our Silicon Valley facility to meet your complex medical device assembly needs: 

  • Yamaha pick and place capable of 67,000 placements per hour
  • Disco DAG810 fully automatic surface grinder with high-rigidity, low-vibration spindle for superior grinding on hard or brittle substrates and resin
  • Disco DFD6362 with high-rigidity spindle for dicing wafers up to 300 mm with increased processing stability
  • Disco DFD6240 for dicing ceramic, glass and other difficult-to-cut materials, featuring precise process management to expedite high-load requirements
  • ATV Vacuum Reflow System with precision recipe-controlled gas flow
  • Datacon 2200 EVO Plus Die Bonder for precision die placement and stacked die applications
  • K&S IConn Plus Wirebonder with high accuracy bond placement and tight loop controls
  • Component wet cleaning in C100 environment
  • Dry storage systems for quality assurance
  • Class 100 and Class 1000 cleanrooms

SJSU Biomedical Device Conference Breaks Attendance Records

An estimated 450 attendees, many San Jose State University students, connected with exhibitors at the 9th Annual Bay Area Biomedical Device Conference this week. Promex is a gold sponsor of this event featuring industry leaders in biomechanics, smart sensors, wearables and more. We’ve no doubt this next generation of innovators will help us continue to solve your microelectronic assembly and design needs.

Quik-Pak takes QFNs on the Road

Did you see our Quik-Pak Division at APEC in San Antonio earlier this month? How about at GOMAC Tech in Miami, Florida? If not, you’ll have another chance at the Long Island RF/Microwave Symposium & Exhibits on April 5th. It’s free for attendees but you must register in advance at Quik-Pak offers IC packaging and assembly services for your power electronics. And can help with your microelectronics and security applications. Whether you need a prototype or full production, their ISO 9001:2008-certified, ITAR-registered facility is ready.
PS -- in a hurry? Is same-day assembly fast enough? Find out more at
With the installation of a K&S IConn Plus wirebonder, molding press and laser marker in San Diego, Quik-Pak can deliver assembled QFNs in just five days. Quick-turn engineering builds are available in as little as five weeks after design validation. With 35 designs, multiple thicknesses, and package sizes from 2x2-12x12 mm (1.5x1.5- 4x4 mm for DFNs), Quik-Pak has what you need. All are RoHS compliant and utilize NiPdAu-plated lead frames. As for quality, an independent third-party laboratory confirmed multiple packages with different die attach materials which passed MSL3-level criteria for mechanical integrity per IPC/JEDEC-J-STD-020E. Want to know more? Email Casey Krawiec or call him directly at 858-521-3607.
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