March 2018
$2 Million Heterogeneous Assembly Equipment Investment
Two years. Two million dollars. Check out what we’ve added at our Silicon Valley facility to meet your complex medical device assembly needs:
- Yamaha pick and place capable of 67,000 placements per hour
- Disco DAG810 fully automatic surface grinder with high-rigidity, low-vibration spindle for superior grinding on hard or brittle substrates and resin
- Disco DFD6362 with high-rigidity spindle for dicing wafers up to 300 mm with increased processing stability
- Disco DFD6240 for dicing ceramic, glass and other difficult-to-cut materials, featuring precise process management to expedite high-load requirements
- ATV Vacuum Reflow System with precision recipe-controlled gas flow
- Datacon 2200 EVO Plus Die Bonder for precision die placement and stacked die applications
- K&S IConn Plus Wirebonder with high accuracy bond placement and tight loop controls
- Component wet cleaning in C100 environment
- Dry storage systems for quality assurance
- Class 100 and Class 1000 cleanrooms
