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October 2017
New Promex Website Designed with You in Mind Have you seen our new website at www.promex-ind.com? Everything is easy to find and view, no matter whether you’re at your desk or on a mobile device. Each service area (Process Engineering, Wafer Processing, Assembly and Packaging) has its own page. And there’s a page for Quality, too, because it’s just that important. If you’re responsible for developing medical devices, biotech products, automotive sensors, or unique technical/industrial applications, we can help. All the “must have” sections are on the new site too, including an expanded About Us, 356 downloadable Chip Package Drawings, the Knowledge Center, Newsroom, Career Opportunities, and more. If there’s anything you’d like us to add or improve, Rosie Medina would love to hear from you.
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Overmolded QFNs Produced in San Diego
When you need overmolded QFN Packages for quick-turn engineering builds, Quik-Pak’s new San Diego production line can assemble and ship standard packages in five days. Overmolded, open-tooled QFN and DFN packages come in 35+ designs and multiple thicknesses. Package sizes range from 2x2 to 12x12 mm for QFNs and 1.5x1.5 to 4x4 mm for DFNs. All QFNs are RoHS compliant and utilize NiPdAu-plated lead frames. With a K&S IConn Plus wirebonder, molding press and laser marker onsite, Quik-Pak is your alternative to going offshore for high-volume production. Casey Krawiec is waiting for your call at 1-858-521-3607.
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Meet Our New Engineering and Quality Directors Christian Walton thoroughly understands the needs of our medical device customers, having previously worked with Promex to fabricate his own product designs. Now as Senior Director of Engineering, Christian will help his team leap tall buildings, tame manufacturing challenges and meet aggressive production schedules. Before joining Promex, he held executive positions at Beta Phase, Raychem, Triple Ring Technologies, Circle Medical (now CIRTEC), R2 Technology (now Hologic) and Natus Medical. Christian holds a MS in Mechanical Engineering from Stanford University and a BS in Mechanical Engineering from Carnegie-Mellon University.
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Taren Nguyen is a subject matter expert on FDA standards, the FDA submission process and FDA software validation. As our new Director of Quality, he’ll work with you to get ready for production, while keeping a watchful eye on ISO, ITAR, OSHA and EPA compliance. Previously, Taren held positions in quality at Victron, Blowfish Information Technology, Sanmina-SCI and Roche Diagnostics. He earned an MS in Information Management Systems from DeVry University and a BA in biochemistry from California State University, East Bay.
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Miniaturization and High-Density Packaging
Annette Teng, Promex Chief Technology Officer and Chair of the IEEE-EPS (CPMT) Santa Clara Valley/Bay Area Chapter, was the featured speaker at an IEEE event on wafer thinning and singulation -- a critical process for successful miniaturization and high-density packaging. Annette compared dicing yields and cost of various die singulation techniques, including stealth laser, laser abrasion, plasma etch and conventional rotary blade. She also presented results of a Disco stealth laser used on singulated II-VI and III-V type dies. We'll have a summary of her presentation available soon. In the meantime, be sure to read Annette's white paper on the various ways Die Attach Film (DAF) can be implemented for complex microelectronic assemblies.
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Upcoming Events
Speaking of IEEE, Quik-Pak will be exhibiting at the IEEE Compound Semiconductor ICS, Oct. 23-24 in Miami, Florida and the IEEE Nuclear Science Symposium & Medical Imaging Conference, Oct 24-26 in Atlanta, Georgia. On November 30, swing back to Silicon Valley for “Heterogeneous Integration – The Road to Implementation” in our booth at MEPTEC’s Semiconductor Packaging Symposium. Promex is a gold sponsor of the event and we’ll have nifty tchotchkes for you.
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