Over the past year, one of the focal points of our efforts has been to expand our capabilities and facilities in the areas of advanced packaging and 3D heterogeneous integration (APHI). With the support and leadership from the Institute of Matter and Systems (IMS) and the Office of the Executive Vice President for Research, we recently completed a 2,000 sq. ft. cleanroom expansion in the Marcus Nanotechnology Building, bringing the total Marcus cleanroom space to more than 23,000 sq ft. Further, over the past year, we have ordered several major fabrication tools that will provide the campus community and our industry and government partners with unique capabilities to pursue revolutionary technologies in APHI for applications that include artificial intelligence, mm-wave and photonic communication systems, quantum computing, and biomedical microdevices. We have already installed a few of these tools with the majority of the remaining tools arriving later this year. We are excited to see all the new technologies and partnerships that will be developed from leveraging this expansion. 

Fall IAB Meeting, November 11-12, 2025

Georgia Tech 3D Systems Packaging Research Center Fall IAB 2025 is scheduled to take place on November 11-12, 2025.  The meeting will be held in the Dalney Building on Georgia Tech campus. The IAB is a PRC member only meeting. We look forward to seeing our members back on-campus.

Georgia Tech 3D Systems Packaging Research Center Spring IAB 2025 attracted 112 participants from our industry members, and Georgia Tech faculty and students. The meeting featured three keynote speakers, and 26 presentations from faculty and students.

Pragna Bhaskar
Dr. Bhaskar recently joined the PRC as a Postdoctoral Fellow. She holds a PhD in Materials Science and Engineering from Georgia Institute of Technology. At the PRC, Pragna conducts research on PRC consortium projects and center-wide projects. She also mentors PRC graduate students.

Abhishek Parmar
Abhishek recently joined the PRC as a Laboratory Technician II. In his role, Abhishek works with PRC students supporting them throughout various stages of fabrication and characterization of test vehicles using destructive and nondestructive methods. 

IEEE ECTC Student Design Competition Winning Team

The IEEE ECTC Student Design Competition invites teams of up to three enrolled students (BSc, MSc, or PhD) to address advanced challenges in electronic packaging and reliability engineering. The competition follows a three-phase process: an initial two-page technical project outline, selection of the top 10 teams to submit a detailed six-page engineering report, and final selection of three winning teams to present their work at the IEEE ECTC conference. Problem statements target high-impact areas such as predictive finite element modeling and warpage mitigation in optical MEMS integration, computational analysis of CTE mismatch in multi-material packages, thermal resistance reduction in high-temperature power modules, thermo-mechanical co-design for heterogeneous opto-electronic systems, and advanced sensing or condition monitoring concepts for electronics. Emanuel Torres Surillo, Christian Molina-Mangual, and Ramon A. Sosa advised by Professor Vanessa Smet won the competition by developing a modern framework that integrates Bayesian Optimization with Finite Element Analysis (FEA), enabling efficient multi-parameter design space exploration and optimization to enhance reliability and performance in advanced electronic packaging. This achievement highlights how data-driven optimization, when coupled with high-fidelity simulation, can deliver innovative, industry-relevant solutions to complex thermo-mechanical challenges in advanced electronic packaging.

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